Effect of Area-Filling Path on the Residual Stresses Developed During Weld-Deposition Based Additive Manufacturing

Robi, Mathews (2013) Effect of Area-Filling Path on the Residual Stresses Developed During Weld-Deposition Based Additive Manufacturing. Masters thesis, Indian Institute of Technology Hyderabad.

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Abstract

There is an increasing interest in the industry for using Additive Manufacturing techniques not just for prototyping but for actual applications too. For this to happen, various constraints in commercialization of the metallic components made by using additive manufacturing have to be overcome. Management of thermally induced residual stresses during the deposition of metal is one of the major challenges that need to be addressed. With the help of numerical and experimental methods, this paper studies effect of area filling paths on the residual stresses developed during weld-deposition. Finite element analysis is done using ANSYS Mechanical APDL for different area filling paths. The temperature gradient and the thermally induced residual stress produced during material deposition are predicted using finite element analysis. The obtained results were validated with the help of experiments. A GMAW welding system was attached to the CNC to create the desired area filling pattern. The residual stresses were measured using a XRD system. The process parameters used in the finite element study and experiments were based on initial trials carried out to determine the operatable range of parameters. Three area-filling patterns viz., zig-zag, contour (outside-in) and contour (inside-out) were analyzed; maximum residual stress concentration was found to occur in the case of contour (outside-in).

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IITH Creators:
IITH CreatorsORCiD
Item Type: Thesis (Masters)
Uncontrolled Keywords: TD111
Subjects: Others > Mechanics
Divisions: Department of Mechanical & Aerospace Engineering
Depositing User: Team Library
Date Deposited: 14 Nov 2014 10:37
Last Modified: 08 May 2019 11:52
URI: http://raiithold.iith.ac.in/id/eprint/790
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