Electrochemical self-assembled monolayer desorption assisted low temperature Cu-Cu thermocompression bonding

Ghosh, T and Singh, Shiv Govind and Vanjari, Siva Rama Krishna (2014) Electrochemical self-assembled monolayer desorption assisted low temperature Cu-Cu thermocompression bonding. In: ICEE 2014, 3-6 December 2014, Bangalore, India.

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IITH Creators:	IITH Creators ORCiD Singh, Shiv Govind http://orcid.org/0000-0001-7319-879X
Item Type:	Conference or Workshop Item (Paper)
Subjects:	Electrical Engineering
Divisions:	Department of Electrical Engineering
Depositing User:	Library Staff
Date Deposited:	12 Sep 2019 05:01
Last Modified:	12 Sep 2019 05:01
URI:	http://raiithold.iith.ac.in/id/eprint/6199
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