Impact of multi-Vt technique in eliminating thermal runaway during testing of 3D chips

Potluri, S and Trinadh, A Satya and Sobhan Babu, Ch and Singh, Shiv Govind and Kamakoti, V (2015) Impact of multi-Vt technique in eliminating thermal runaway during testing of 3D chips. In: Design Automation and Test in Europe,3D workshop, IEEE, 2015, Grenoble, France.

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IITH Creators:	IITH Creators ORCiD Sobhan Babu, Ch UNSPECIFIED Singh, Shiv Govind http://orcid.org/0000-0001-7319-879X
Item Type:	Conference or Workshop Item (Paper)
Subjects:	Electrical Engineering
Divisions:	Department of Electrical Engineering
Depositing User:	Team Library
Date Deposited:	27 Jun 2019 05:18
Last Modified:	27 Jun 2019 05:18
URI:	http://raiithold.iith.ac.in/id/eprint/5567
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