Items where Subject is "Electrical Engineering > Automation & Control Systems"

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Acharyya, Amit (2023) RF choke based methodology for flange effect mitigation and antenna isolation improvement in bistatic radars of aerospace vehicles. AEÜ - International Journal of Electronics and Communications, 159. p. 154451. ISSN 1434-8411

Agarwal, P and Thomas, D E and Kumar, Abhinav (2017) Security Analysis of LTE/SAE Networks Under De-synchronization Attack for Hyper-Erlang Distributed Residence Time. IEEE Communications Letters, 21 (5). pp. 1055-1058. ISSN 1089-7798

Anand, B. and Rajalakshmi, P. and et al, . (2020) Region of Interest and Car Detection using LiDAR data for Advanced Traffic Management System. In: IEEE World Forum on Internet of Things, WF-IoT 2020 - Symposium Proceedings, 2nd - 16th June 2020.

Arora, Aayush and Shantanu, . (2022) A Review on Application of GANs in Cybersecurity Domain. Taylor and Francis Ltd..

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Badami, Oves (2023) Lateral P–N Junction Photodiodes Using Lateral Polarity Structure GaN Films: A Theoretical Perspective. Journal of Electronic Materials, 52 (3). pp. 2148-2157. ISSN 0361-5235

Badhulika, Sushmee (2023) Nickel MXene Nanosheet and Heteroatom Self-Doped Porous Carbon-Based Asymmetric Supercapacitors with Ultrahigh Energy Density. Energy & Fuels, 37 (6). pp. 4701-4710. ISSN 0887-0624

Bhati, Saurabhchand and Nayak, Shekhar and Murty, K. Sri Rama (2017) Unsupervised Speech Signal to Symbol Transformation for Zero Resource Speech Applications. In: Proceedings of the Annual Conference of the International Speech Communication Association, INTERSPEECH, 20-24 August 2017, Stockholm; Sweden.

Bhimireddy, Prathap Reddy Reddy and Iqbal, Atif and K, Siva Kumar and Alhitmi, M.A. and Hasan, Anwarul and Mehrjerdi, H and Paraprath, Asokan and Shakoor, Abdul (2021) Performance Enhancement of PPMIM Drives by using 3 Three-Phase Four-Leg Inverters. IEEE Transactions on Industry Applications. p. 1. ISSN 0093-9994

Bonam, Satish and Kumar, C Hemanth and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2019) Achieving of aluminum–aluminum wafer bonding at low temperature and pressure using Surface passivated technique. In: 21st Electronics Packaging Technology Conference, EPTC 2019, 4-6 December, 2019, Singapore,.

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Cheemalamarri, Hemanth Kumar and Bonam, Satish and Banik, Dhiman and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2019) Interface Analysis of High Reliable Hermitic Sealed Microfluidic Channels for Thermal Cooling in 3D ICs. In: 2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019, 4-6 December 2019, Singapore.

Cheemalamarri, Hemanth Kumar and Bonam, Satish and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2020) Effect of ultrathin palladium layer in achieving a low temperature and pressure wafer level aluminum to aluminum bonding. Surface Topography: Metrology and Properties, 8 (4). 045008. ISSN 2051-672X

Cheemalamarri, Hemanth Kumar and Bonam, Satish and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2020) Ti/Si interface enabling complementary metal oxide semiconductor compatible, high reliable bonding for inter-die micro-fluidic cooling for future advanced 3D integrated circuit integration. Journal of Micromechanics and Microengineering, 30 (105005). ISSN 0960-1317

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D.V.L.N, Dheeraj Sai and K.S, Kishor and Kodukula, Sri Rama Murty (2018) Speech Source Separation Using ICA in Constant Q Transform Domain. In: Proceedings of the Annual Conference of the International Speech Communication Association, INTERSPEECH, 2-6 September 2018, Hyderabad; India.

Dendi, Sathya Veera Reddy and Channappayya, Sumohana (2020) No-Reference Video Quality Assessment Using Natural Spatiotemporal Scene Statistics. IEEE Transactions on Image Processing. pp. 5612-5624. ISSN 1941-0042

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Gajula, Jyothi (2017) Reducing Distribution Losses using Distributed Reactive Power Support. Masters thesis, Indian Institute of Technology Hyderabad.

Gunapu, D V Santhosh Kumar and Joseph, Jose and Singh, Shiv Govind and Vaniari, Siva Rama Krishna (2018) Selective Anisotropic Dry Etching of Piezoelectric Silk Microstructures Using Oxygen Plasma Ashing. In: Proceedings of IEEE Sensors, 28-31 October 2018, New Delhi; India.

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Joseph, Jose and Kumar, Manish and Tripathy, Suryasnata and Kumar, G D V Santhosh and Singh, Shiv Govind and Vaniari, Siva Rama Krishna (2018) A Highly Flexible Tactile Sensor with Self-Poled Electrospun PVDF Nanofiber. In: IEEE SENSORS, 28-31 October 2018, New Delhi.

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Kumar, A R R and Sahoo, B D and Dutta, Asudeb (2017) A Wideband 2-5 GHz Noise Canceling Subthreshold Low Noise Amplifier. IEEE Transactions on Circuits and Systems II: Express Briefs. p. 1. ISSN 1549-7747 (In Press)

Kumar, Abhinav (2023) Multitarget Angle of Arrival Estimation Using Rotating mmWave FMCW Radar and Yolov3. IEEE Sensors Journal, 23 (3). pp. 3173-3182. ISSN 1530-437X

Kumar, Ajay and Taparia, Mahesh and Madapu, Amarlingam and P, Rajalakshmi and Marathi, Balram and Desai, U B (2020) Discrimination of filled and unfilled grains of rice panicles using thermal and RGB images. Journal of Cereal Science, 95. p. 103037. ISSN 0733-5210

Kumar, C Hemanth and Bonam, Satish and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2018) High Density metal alloy Interconnections Using Novel Wafer Bonding Approach For 3D IC Packaging Applications. In: Electronics Packaging Technology Conference, 4-7 December 2018, Singapore,.

Kumar, Sanni and Vasylieva, Natalia and Singh, Vikrant and Hammock, Bruce and Singh, Shiv Govind (2020) A Facile, Sensitive and Rapid Sensing Platform Based on CoZnO for Detection of Fipronil; an Environmental Toxin. Electroanalysis, 32 (9). pp. 2056-2064. ISSN 1040-0397

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M, Pavan Reddy and Kumar, Abhinav and Kuchi, Kiran (2021) Design and performance analysis of joint control and shared channel scheduler for downlink in 3GPP narrowband-IoT. Ad Hoc Networks, 114. p. 102440. ISSN 1570-8705

Manne, Shanmukh Reddy (2023) Pigment epithelial detachment composition indices (PEDCI) in neovascular age-related macular degeneration. Scientific Reports, 13 (1). p. 68. ISSN 2045-2322

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Paul, N. and Vadnala, S. and Agrawal, A and Vanjari, Siva Rama Krishna and Singh, S.G. (2018) Thermal and Optoelectrical Analysis of La0.7Sr0.3MnO3 Thin Film Thermistor in 8-12 μm Range for Uncooled Microbolometer Application. In: 2018 IEEE Electron Devices Kolkata Conference (EDKCON), 24-25 Nov 2018, Kolkata; India.

Paul, Nirupam and Singh, Shiv Govind (2018) Dependency of fT and fMAX on Various Device Parameters of AIGaN/GaN HEMT. In: IEEE Electron Devices Kolkata Conference (EDKCON), 24-25 Nov. 2018, Kolkata, India.

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Ranjan, S and Mathukumalli, V (2017) Tight Performance Bounds for Compressed Sensing With Group Sparsit. In: 3rd Indian Control Conference (ICC), JAN 04-06, 2017, Indian Inst Technol Guwahati Campus, Guwahati, INDIA.

Reddy, B Prathap and Meraj, M and Iqbal, A and K, Siva Kumar and Al-Hitmi, M (2021) A Single DC Source-Based Three-Level Inverter Topology for a Four-Pole Open-End Winding Nine-Phase PPMIM Drives. IEEE Transactions on Industrial Electronics, 68 (4). pp. 2750-2759. ISSN 0278-0046

Regulagadda, Sesha Sairam and Nagaveni, S and Dutta, Asudeb (2020) A Package Aware QLMVF Receiver Front End. IEEE Transactions on Circuits and Systems II: Express Briefs, 67 (9). pp. 1584-1588. ISSN 1549-7747

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Tripathy, Suryasnata and Singh, Shiv Govind (2021) Electrospun Mn₂O₃ Nanofiber Networks as Bio-Transducers: Electrical Characterization, Modeling, and DNA Sensing. IEEE Transactions on Electron Devices, 68 (4). pp. 1892-1898. ISSN 0018-9383

Tripathy, Suryasnata and Supraja, Patta and Singh, Shiv Govind (2020) Electrochemical Nanoengineered Sensors in Infectious Disease Diagnosis. In: Nanobiomaterial Engineering. Springer Singapore, pp. 165-180. ISBN 978-981329840-8; 978-981329839-2

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Venkatesh, Eliganti and Singh, Suraj and Tripathy, Suryasnata and Singh, Shiv Govind (2019) Amorphous-Carbon/Si Heterojunction Device for Room-Temperature NH3 Sensing. IEEE Sensors Letters, 3 (2). pp. 1-4. ISSN 2475-1472

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Yegnanarayana, B. and Kodukula, Sri Rama Murty (2009) Event-Based Instantaneous Fundamental Frequency Estimation From Speech Signals. IEEE Transactions on Audio, Speech, and Language Processing, 17 (4). pp. 614-624. ISSN 1558-7916