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Siddhu, Lokesh and Kedia, Rajesh and Pandey, Shailja and et al, . (2022) CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems. ACM Transactions on Architecture and Code Optimization, 19 (3). pp. 1-25. ISSN 1544-3566
