High Speed Silicon Wet Bulk Micromachining of Si{111} in KOH Based Solution

Rao, A. V. N. and Pal, P. and et al, . (2020) High Speed Silicon Wet Bulk Micromachining of Si{111} in KOH Based Solution. 2020 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2020 (913914).

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Abstract

The etching characteristics of Si{111} in pure and NH2OH-added 20 wt% KOH are investigated for the fabrication of MEMS structures using silicon wet bulk micromachining. The addition of NH2OH favorably modifies the etching characteristics of 20 wt% KOH, which are useful for high speed silicon wet bulk micromachining for the fabrication MEMS structures such as cavities, microcantilevers, etc. In addition, the lateral undercutting rate drastically increases in NH2OH-added KOH, which is a desirable property for the fast release of freestanding micro/nanoelectromechanical systems (M/NEMS) structures.

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