Effect of Temperature and Strain rate on Flow behavior of Al0.3CoCrFeNi HEA

Naidu, Palleda Thaviti and Korla, Rajesh (2019) Effect of Temperature and Strain rate on Flow behavior of Al0.3CoCrFeNi HEA. Masters thesis, Indian institute of technology Hyderabad.

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Abstract

High-entropy alloys (HEAs) are currently attracting much interest because they offer unique properties and good ductility at low temperatures. These materials are of interest primarily because they contain five or more principal elements, with each element having a concentration between 5 and 35 at. %, and yet they have very simple structures based on solid solution phases. Super plasticity is major concern for forming industries to fabricate complex and curves components, to use in automotive, aerospace and other application. In addition to that, the materials used in automobile and other structural applications often encountered with shock loadings. Recent experiments have shown that the HEAs also have a potential for exhibiting superplastic property when testing at elevated temperatures. Since super-plasticity requires a very small grain size, typically < 10 μm, it is feasible to introduce significant grain refinement by thermomechanical processing. The main aim of this work is to develop Al0.3CoCrFeNi high entropy alloy with very fine equi-axed stable grain microstructure using proper thermomechanical treatment. Study the deformation behavior both at room and high temperature. Explore the possibility of super plasticity. Further, study the effect of temperature and strain rate on the deformation behavior.

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IITH Creators:
IITH CreatorsORCiD
Korla, RajeshUNSPECIFIED
Item Type: Thesis (Masters)
Uncontrolled Keywords: High Entropy alloy, Microstructure, High temperature tensile, Super plasticity Fractography
Subjects: Materials Engineering > Materials engineering
Divisions: Department of Material Science Engineering
Depositing User: Team Library
Date Deposited: 06 Aug 2019 06:17
Last Modified: 06 Aug 2019 06:17
URI: http://raiithold.iith.ac.in/id/eprint/5870
Publisher URL:
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