Optimized ultra-thin Ti Passivation leads high quality fine pitch bump less Cu-Cu Wafer-on-Wafer bonding at 1750 C

Panigrahi, Asisa Kumar and Bonam, Satish and Ghosh, Tamal and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2015) Optimized ultra-thin Ti Passivation leads high quality fine pitch bump less Cu-Cu Wafer-on-Wafer bonding at 1750 C. In: 18th International Workshop on Physics of Semiconductor Devices (IWPSD), 2015, Bangalore, India.

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IITH Creators:	IITH Creators ORCiD Singh, Shiv Govind http://orcid.org/0000-0001-7319-879X Vanjari, Siva Rama Krishna UNSPECIFIED
Item Type:	Conference or Workshop Item (Paper)
Subjects:	Electrical Engineering
Divisions:	Department of Electrical Engineering
Depositing User:	Team Library
Date Deposited:	27 Jun 2019 04:46
Last Modified:	27 Jun 2019 04:46
URI:	http://raiithold.iith.ac.in/id/eprint/5565
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