Kumar, C Hemanth and Panigrahi, Asisa Kumar and Singh, Shiv Govind
(2017)
Facile approach of enhanced heat mitigation between 3D stacked layers by Introducing a sub-micron thick heat spreading materials.
In: 49th international conference on solid state devices and materials (SSDM).
Abstract
Polder and Van Hove in 1971 forecasted, it is possible to transfer heat between the planer surface by phonon tunneling mechanism, having interlayer separation
that is comparable to the phonon wavelength. Towards
that, in this work we examined the heat mitigation issues
widely prevalent in 3D stacked ICs using finite element
analysis. We observed batter heat mitigation by using optimized thickness of heat spreader sandwiched between
ICs, containing TTSVs. FEM result shows nearly 15 oC
reduction in temperature from 313oC to 298 oC of the top
most IC in a 3D stack compared with the case without
TTSV and heat spreader in the ILD plane.
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