Interface delamination in stepped lap repaired CFRP panel under tensile loading

Jain, Rajeev and Chinthapenta, Viswanath (2018) Interface delamination in stepped lap repaired CFRP panel under tensile loading. Masters thesis, Indian Institute of Technology Hyderabad.

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Abstract

The thin adhesive layer between the parent structure and the patch in adhesive bonding is the weakest link where interface delamination occurs. This interface delamination exhibits a mixed mode in nature due to the orthotropic behavior of composite and stepped con�guration of joint. For analysis of mixed-mode interface delamination in the single stepped scarf joint, Benzeggagh-Kenane model[1] has used. Under static loading, the result shows that the corners of the steps are in the high-stress concentration zone. And the delamination starts from the tip of the step in a symmetric manner (from the �rst and the last step) and then propagates to the middle of the joint. The tensile strength, peel stress, and shear stress distribution were investigated numerically concerning parameters such as some steps, scarf angle change on varying step length and step height and the adhesive bond line thickness. The results show that on increasing the number of steps and scarf angle by changing step length, the tensile strength of joint increases. And note the signi�cant e�ect on the tensile strength with varying step height and bond line thickness. So better design of the stepped lap joint in the composite structure increases the performance of the joint.

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