Settlement Analysis of Circular Footings on Layered Soil Systems

Sekar, P and B, Umashankar and M R, Madhav (2014) Settlement Analysis of Circular Footings on Layered Soil Systems. In: Golden Jubilee Conference of the IGS Bangalore Chapter, Geo - Innovations, 30-31 Oct, 2014, IISc Bangalore, India.

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Abstract

Many studies are available on the settlement analysis of footings on a homogeneous soil deposit underlain by a rigid base. However, the soil profile is seldom homogenous and typically a layered soil system is encountered in practice. The present study deals with the settlement profiles of soil underneath a circular footing of radius equal to a, and resting on a finite two-layered soil system with thicknesses equal to H1 and H2. The deformation moduli and Poisson’s ratios of the two layers are E1, υ1, and E2, υ2. The settlement profiles are proposed for varying H1/a and H2/a ratios (H1/a= 0.2, 0.5, 1, 2, 4 and 6, and H2/a= 1, 2, 4 and 6). The moduli ratio E1/E2is varied as 0.01, 0.05, 0.1, 0.5, 1, 2, 5 and 20. The extent of settlement due to load is also proposed from the surface settlement profile which can help in determining the influence of a footing on the neighboring footing or structure. The analysis is carried out using PLAXIS 2D vAE. In addition, the settlement influence factors are proposed for the above mentioned ratios to estimate the maximum settlement of the footing on a layered system. The results are also compared with the settlement measured in a building on a layered system in Adelaide, Southern Australia, and the results are found to be comparable.

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IITH Creators:
IITH CreatorsORCiD
B, UmashankarUNSPECIFIED
M R, MadhavUNSPECIFIED
Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: settlement, circular loading, layered system, elastic analysis
Subjects: Civil Engineering > Soil Structure Interaction
Divisions: Department of Civil Engineering
Depositing User: Library Staff
Date Deposited: 20 May 2016 09:18
Last Modified: 01 Sep 2017 06:36
URI: http://raiithold.iith.ac.in/id/eprint/2394
Publisher URL:
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