Interlayer Exchange Coupled Based Nanomagnetic Multiplier Architecture Design Methodology
Mattela, Venkat and Debroy, Sanghamitra and Sivasubramani, Santhosh and Acharyya, Amit (2021) Interlayer Exchange Coupled Based Nanomagnetic Multiplier Architecture Design Methodology. IEEE Transactions on Nanotechnology, 20. pp. 744-753. ISSN 1536-125X
Text
IEEE_Transactions1.pdf - Published Version Restricted to Registered users only Download (10MB) | Request a copy |
Abstract
In this manuscript, Inter-Layer Exchange Coupled (IEC) based 2-bit multiplier architecture model methodology has been proposed here and to the best of author's knowledge is the first of its kind. Subsequently, the proposed model methodology has been executed using the extensively recognized Object Oriented Micro-Magnetic Framework (OOMMF) platform. The reliability of the IEC based multiplier model was determined by analyzing the temperature variation impact up to the Curie temperature. It was noticed that unlike the dipole coupled architecture, the IEC based multiplier model has the capability of operating even up to Curie temperature at sub-50nm justifying stability with respect to the temperature variations. © 2002-2012 IEEE.
IITH Creators: |
|
||||
---|---|---|---|---|---|
Item Type: | Article | ||||
Uncontrolled Keywords: | 2-bit multiplier; Curie temperature effect; interlayer exchange coupling; reliability | ||||
Subjects: | Electrical Engineering | ||||
Divisions: | Department of Electrical Engineering | ||||
Depositing User: | . LibTrainee 2021 | ||||
Date Deposited: | 01 Sep 2022 05:59 | ||||
Last Modified: | 01 Sep 2022 05:59 | ||||
URI: | http://raiithold.iith.ac.in/id/eprint/10364 | ||||
Publisher URL: | http://doi.org/10.1109/TNANO.2021.3115936 | ||||
OA policy: | https://v2.sherpa.ac.uk/id/publication/3529 | ||||
Related URLs: |
Actions (login required)
View Item |
Statistics for this ePrint Item |