Interlayer Exchange Coupled Based Nanomagnetic Multiplier Architecture Design Methodology

Mattela, Venkat and Debroy, Sanghamitra and Sivasubramani, Santhosh and Acharyya, Amit (2021) Interlayer Exchange Coupled Based Nanomagnetic Multiplier Architecture Design Methodology. IEEE Transactions on Nanotechnology, 20. pp. 744-753. ISSN 1536-125X

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Abstract

In this manuscript, Inter-Layer Exchange Coupled (IEC) based 2-bit multiplier architecture model methodology has been proposed here and to the best of author's knowledge is the first of its kind. Subsequently, the proposed model methodology has been executed using the extensively recognized Object Oriented Micro-Magnetic Framework (OOMMF) platform. The reliability of the IEC based multiplier model was determined by analyzing the temperature variation impact up to the Curie temperature. It was noticed that unlike the dipole coupled architecture, the IEC based multiplier model has the capability of operating even up to Curie temperature at sub-50nm justifying stability with respect to the temperature variations. © 2002-2012 IEEE.

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IITH Creators:
IITH CreatorsORCiD
Acharyya, Amithttp://orcid.org/0000-0002-5636-0676
Item Type: Article
Uncontrolled Keywords: 2-bit multiplier; Curie temperature effect; interlayer exchange coupling; reliability
Subjects: Electrical Engineering
Divisions: Department of Electrical Engineering
Depositing User: . LibTrainee 2021
Date Deposited: 01 Sep 2022 05:59
Last Modified: 01 Sep 2022 05:59
URI: http://raiithold.iith.ac.in/id/eprint/10364
Publisher URL: http://doi.org/10.1109/TNANO.2021.3115936
OA policy: https://v2.sherpa.ac.uk/id/publication/3529
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